Copper foil is a foil form of copper less than the thickness of 150µm and there are two types, a rolled copper foil and an electrolytic copper foil. Normally, a rolled copper foil is made by rolling and annealing electrolytic copper continuously and there is a restriction of the length. In contrast, an electrolytic copper foil has no restriction of the length. Copper Foils are mostly used for printed circuit boards, flexible printed circuit boards, and lithium-ion batteries.
Copper Foil market has several key players, like CCP, NPC, Furukawa Electric, and Mitsui Mining & Smelting, they take a market share of around 41.04% in sales, and46.505% in Revenue.
Global giant manufactures mainly distributed in Asia-Pacific. It has unshakable status in this field. China takes the consumption market share of 43.89% in 2016, Taiwan followed by with 21.72% in 2016.
Over the next five years, LPI(LP Information) projects that Copper Foil will register a 2.2% CAGR in terms of revenue, reach US$ 5660 million by 2023, from US$ 4970 million in 2017.
This report studies the global market, especially in North America, Europe, Asia-Pacific, South America, Middle East and Africa, focuses on the top 5 players in each region, with sales, price, revenue and market share from 2013 to 2018, the top players:
Mitsui Mining & Smelting
JX Nippon Mining & Metal
Tongling Nonferrous Metal Group
Market Segment by Regions, this report splits Global into several key Regions, with sales, revenue, market share of top players in these regions, from 2013 to 2018 (forecast), like
North America (United States, Canada and Mexico)
Asia-Pacific (China, Japan, Southeast Asia, India and Korea)
Europe (Germany, UK, France, Italy and Russia etc.)
South America (Brazil, Chile, Peru and Argentina)
Middle East and Africa (Egypt, South Africa, Saudi Arabia)
Split by Product Types, with sales, revenue, price, market share of each type, can be divided into
Rolled Copper Foil
Electrolytic Copper Foil
Split by applications, this report focuses on sales, market share and growth rate in each application, can be divided into
Printed Circuit Board