Anti-Static Packaging Materials Market by Manufacturers, Regions, Type and Application, Forecast to 2023

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Anti-static packaging materials are packaging containers which could protect the content from static damage. They are mainly used for packaging electronic components. Anti-static packaging materials usually include anti-static bag, anti-static sponge, anti-static grid, etc.

Scope of the Report:
This report focuses on the Anti-Static Packaging Materials in global market, especially in North America, Europe and Asia-Pacific, South America, Middle East and Africa. This report categorizes the market based on manufacturers, regions, type and application.
The anti-static packaging materials are mainly used in electronic industry, chemical industry, pharmaceutical industry and others Report data showed that 72.61% of the anti-static packaging materials market demand in electronic industry, 15.19% % in chemical industry, and 7.49% in pharmaceutical industry in 2015. With the development of economy, these industries will need more anti-static packaging materials. So, anti-static packaging materials have a huge market potential in the future.
We tend to believe this industry is a rising industry, and the consumption increasing degree will show a smooth growth curve. And the sales price presents a downward trend according to the economy development status.

The worldwide market for Anti-Static Packaging Materials is expected to grow at a CAGR of roughly 4.0% over the next five years, will reach 470 million US$ in 2023, from 370 million US$ in 2017, according to a new GIR (Global Info Research) study.

 

Market Segment by Manufacturers, this report covers
Miller Packaging
Desco Industries
Dou Yee
BHO TECH
DaklaPack
Sharp Packaging Systems
Mil-Spec Packaging
Polyplus Packaging
Pall Corporation
TIP Corporation
Kao Chia
Sewha
Cir-Q-Tech Tako
MK Master
LPS Industries
Taipei Pack
Advance Packaging
Kim Sheng Plastic Packaging
Taiwan Lamination
Shin Harn Plastic
Anand Engineering Udyog
Selen Science & Technology
TA&A
Sanwei Antistatic
Btree Industry
Commodities Source Industrial
ACE ESD(Shanghai)
Junyue New Material
Betpak Packaging
Heyi Packaging
Shanghai Jinghou
Fujingtang
Baiyou Packaging Material
Pinyao Packaging Material
Wentianhao Packaging
Beihong Packaging
Yuyi Packaging
Xinbao Ruifeng

 

Market Segment by Regions, regional analysis covers
North America (United States, Canada and Mexico)
Europe (Germany, France, UK, Russia and Italy)
Asia-Pacific (China, Japan, Korea, India and Southeast Asia)
South America (Brazil, Argentina, Colombia etc.)
Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)

Market Segment by Type, covers
Electrostatic shielding type
Static conductive type

Market Segment by Applications, can be divided into
Electronic
Others

There are 15 Chapters to deeply display the global Anti-Static Packaging Materials market.
Chapter 1, to describe Anti-Static Packaging Materials Introduction, product scope, market overview, market opportunities, market risk, market driving force;
Chapter 2, to analyze the top manufacturers of Anti-Static Packaging Materials, with sales, revenue, and price of Anti-Static Packaging Materials, in 2016 and 2017;
Chapter 3, to display the competitive situation among the top manufacturers, with sales, revenue and market share in 2016 and 2017;
Chapter 4, to show the global market by regions, with sales, revenue and market share of Anti-Static Packaging Materials, for each region, from 2013 to 2018;
Chapter 5, 6, 7, 8 and 9, to analyze the market by countries, by type, by application and by manufacturers, with sales, revenue and market share by key countries in these regions;
Chapter 10 and 11, to show the market by type and application, with sales market share and growth rate by type, application, from 2013 to 2018;
Chapter 12, Anti-Static Packaging Materials market forecast, by regions, type and application, with sales and revenue, from 2018 to 2023;
Chapter 13, 14 and 15, to describe Anti-Static Packaging Materials sales channel, distributors, traders, dealers, Research Findings and Conclusion, appendix and data source

 

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